A diamond-caliber solution, Antec's Formula 7 thermal compound helps keep your CPU cool even when your rig is running on all cylinders. Composed to perform optimally between extreme temperatures of -50 C to 250 C, Formula 7's diamond particles facilitate the transfer of heat between your CPU and heat sink, thus increasing your system's efficiency.

High thermal conductivity. Low thermal resistance. Non-corrosive. Best thermal stability in high temperature. Excellent adhesion. Preserve in room temperature for longer lifespan.